Description
Details
Low-Melting Solder Alloy Stick for SMD & BGA Component Removal – 6.5" Length – 58°C Melt Point – Lead-Free (2): Low-melting solder alloy for SMD and BGA component removal. Melting point: 79-91°C (174°F-195°F) – protects components from overheating.
Key features
- Low-melting solder alloy for SMD and BGA component removal
- Melting point: 79-91°C (174°F-195°F) – protects components from overheating
- 1x, 2x, 4x or 8x 6.5” sticks
- Material: Metal
- Colour: Silver
Product specifics
- Brand: Generic
- Category: Solder
- Colour: Silver
- Material: Metal
- Model: BPSSD01889-SMD4.5NL
- Part number: SMD4.5NL