Description
Details
32F 5X Copper Thermal Pad 15 x 15 x 0.5 mm Copper Thermal Pad HeatSink Chip GPU CPU: Thermal conductivity: 401 w/m-k. Dimensions: 15 x 15 mm.
Key features
- Thermal conductivity: 401 w/m-k
- Dimensions: 15 x 15 mm
- Thickness: 0.5 mm
Product specifics
- Brand: 32F
- Category: Fans & Cooling
- Part number: BMP-EB-DP151505K05

