Description
Details
BGA Reballing Stencil Cell Phone CPU Tinning Stencil Cell for Phone BGA IC Chips Repair for S21 S21 Ultra Series: [Anti Sticking] With multiple IC slots on the body, which effectively prevent small IC from sticking tin and breaking corners. [Applicable CPU] This CPU reballing stencil is applicable for Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU.
Key features
- [Anti Sticking] With multiple IC slots on the body, which effectively prevent small IC from sticking tin and breaking corners
- [Applicable CPU] This CPU reballing stencil is applicable for Qualcomm Snapdragon 888, for SM8350, for xyn2100 CPU
- [Precise Positioning] Precisely made, the reballing template will accurately locate the CPU, with fast tin planting speed and high efficiency
Product specifics
- Brand: Eujgoov
- Category: Soldering Stations
- Model: Eujgoovqht3cy5kno
- Part number: Eujgoovqht3cy5kno