Description
Details
Reballing Station, BGA Reballing Station Solder Rework Kit Soldering Station+Stencils+Balls Kit: The upper cover has a groove which is convenient for removal of excess tin balls. One reballing station can be used with different stencils.
Key features
- The upper cover has a groove which is convenient for removal of excess tin balls
- One reballing station can be used with different stencils
- Can correspond to BGA of different sizes, maximum chip size is 50*50mm
Product specifics
- Brand: Hongzer
- Category: Soldering Stations
- Part number: Hongzer1ig6ar2oy8